Thermal Management
Passive, Powerless Thermal Buffer
For sealed power electronics and EV modules where a fan or liquid loop is impractical — a material that buffers thermal spikes on its own.
Buffer transient heat without a fan
Hotspots in sealed enclosures degrade chips and modules, but active cooling is not always an option. Thermorphous FX25 conducts heat to a sink during normal operation, then absorbs and insulates on overheat — a fail-safe, powerless buffer that also survives to 1000 °C and emits no toxic smoke. It integrates into electronic assemblies and industrial systems.
Datasheet
Download the Thermorphous FX25 datasheet
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Buffering a hotspot?
Tell us the load and enclosure. We will recommend an FX25 integration.